CIF VS-500-V
For medium volume production, where inline reflow solutions are not required, vapour phase technology is the right choice. In addition to production, the BGA is also suitable for reflow and adhesive curing tasks. The advantage of the vapour phase technology is that no time-consuming thermal profiling is required, any PCB can be soldered at high quality with low voids. The design of the machine allows soldering of the most complex boards up to 500 x 500 x 60 mm while ensuring optimum quality.
- Details
- Parameters
- Built-in high efficiency chiller, no need for cooling water or air connection
- Reduced energy consumption
- Profile measurement, control option
- Real-time profile display on the built-in display
- 100% oxygen-free soldering environment without N2 consumption!
- Minimal DeltaT on even the most complex panel
- Extremely low inclusions
- For lead-free soldering or even adhesive curing
- No possible handling errors during the cycle
- Unique vapour recovery system, which greatly reduces liquid consumption and thus production costs
- ESD painted enclosure and ESD glass cover
- Fast payback and high capacity for high-mix production
- High reliability, accuracy and repeatability for all types of soldering
- Compensation for tank pressure fluctuations
- Maximum size of printed circuit board: 500 x 500 x 60 mm
- Maximum PCB weight: 2 kg
- Heating liquid capacity: 5 kg
- Machine size: 830 x 775 x 1140 mm
- Power supply: 3 x 400 V + N / 50 Hz
- Energy consumption: 7.5 kV / H
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HIGH RELIABILITY, ACCURACY, REPEATABILITY
No possible handling errors during the cycle
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HANDLING LARGE PCBS
Maximum panel size handled by the equipment: 500 x 500 x 60 mm
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UNIQUE STEAM RECOVERY SYSTEM
The unique steam recovery system greatly reduces production costs
VIDEOS
CIF VS-500-V VAPOUR PHASE SOLDER
The machine concept allows soldering of the most complex 500 x 500 x 60 mm cards with minimum deltaT, while guaranteeing optimum quality with minimum air entrapment.